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This report provides:
Comprehensive block diagrams of the semiconductor components in a Remote Radio Head;
Details on market drivers which drive performance and cost in the semiconductors;
Description of the methods used by OEMs to address multi-carrier GSM, LTE, WCDMA, HSPA, and other standards ;
Quantitative analysis of transceiver shipments and expected trends for the future; and
Market shares for key semiconductor components including power transistors, FPGAs, Serdes, DACs, ADCs, PLLs, VCOs, AQMs, and RF components.
The forecasts in this report give:
Detailed background of the base station market and general trends toward indoor deployment and multi-mode architectures;
Comprehensive breakdown of transceivers by frequency band, by air interface, and by power level;
Detailed market share analysis for each key semiconductor component; and
Future predictions for the trend in semiconductor content in radio heads.
Overall, this report is intended to provide the data necessary for semiconductor suppliers to chart their roadmap in mobile infrastructure.