Home > Market Research > Networks & Infrastructure > Wireless Infrastructure Equipment Design Analysis - Ericsson GSM/EDGE 850MHz dTRU Model KRC1311005/2

Table of Contents

Management Report
Published: September 2006
Pages: 42
Tables: 48
From: GBP 1250.00   Buy Now!
Research from: EJL Wireless Research
Sector: Networks & Infrastructure

This report covers the design analysis of an Ericsson GSM/EDGE 850MHz dual transceiver/power amplifier unit.

This unit is an integral part of an Ericsson GSM/EDGE base transmitting station (BTS). The unit was manufactured late 2004/early 2005.

The following semiconductor & passive component suppliers are included in this report:
Analog Devices
Altera
EPCOS AG
Infineon Technologies
International Rectifier
Murata Electronics
National Semiconductor
Nippon Precision Circuits
Philips Semiconductors
Sirenza Microdevices
Skyworks Solutions
STMicroelectronics
Texas Instruments
Vishay Semiconductors
Features
Complete Part Number/Marking
Component Manufacturer Identification
Function Component Description
Package Type

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Table of Contents

EXECUTIVE SUMMARY
Active/Passive Component Summary
Important Note:
CHAPTER 1
1.1 Overview of Ericsson Expander RBS and dTRU
CHAPTER 2: TRANSCEIVER
2.1 Transceiver PCB Layout
2.2 Baseband Signal Processing
2.3 Power Management
2.4 Section A
2.4.1 PF3S27 4N Hybrid Module
2.5 Section B Transmitter
2.6 Section C Receiver
2.6.1 PF3S25 46 Hybrid Module
2.7 Section D Switch Matrix
2.8 Section E Timing Control
2.9 Section F Hybrid Module
2.10 Section G Hybrid Module
CHAPTER 3: RF HIGH POWER AMPLIFIER
3.1 Mechanical Analysis
3.2 Power Management
3.3 RF Transmitter
3.4 Output Stage RF Power Transistor
APPENDIX A - PASSIVE CASE SIZE ANALYSIS
APPENDIX B - ACTIVE COMPONENT MARKET SHARE
TABLES
Table 1: Transceiver Baseband Signal Processing Section Bill of Materials
Table 2: Transceiver Power Management Section Bill of Materials
Table 3: Transceiver Section A Bill of Materials
Table 4: PF3S27 4N Hybrid Module Bill of Materials
Table 5: Transceiver Section B Bill of Materials
Table 6: Transceiver Section C Bill of Materials
Table 7: PF3S25 46 Hybrid Module Bill of Materials
Table 8: Transceiver Section D Bill of Materials
Table 9: Transceiver Section D Bill of Materials
Table 10: Transceiver Section F R1E RYT9026010/2 R1D Module
Table 11: Transceiver Section G R1E RYT9026009/2 R1D Module
Table 12: RF Power Amplifier 1 Power Supply Section Bill of Materials
Table 13: RF Power Amplifier 1 RF Transmitter Section Bill of Materials
Table 14: Active/Passive Component Distribution by System Subsection
EXHIBITS
Exhibit 1: Ericsson GSM dTRU Diagram
Exhibit 2: Generic GSM Base Station Diagram
Exhibit 3: Ericsson GSM dTRU Assembly Diagram (Side View)
Exhibit 4: dTRU Transceiver Shield
Exhibit 5: dTRU Power Amplifiers
Exhibit 6: Transceiver with RF Power Amplifiers Removed
Exhibit 7: dTRU Front Panel (Obverse and Reverse) Diagram
Exhibit 8: dTRU Front Panel/Main Housing Diagram (Side View)
Exhibit 9: 850MHz Transceiver Printed Circuit Board (Front View)
Exhibit 10: 850MHz Transceiver Printed Circuit Board (Back View)
Exhibit 11: Baseband Signal Processing Component Diagram
Exhibit 12: Power Management Component Diagram
Exhibit 13: Section A Component Diagram
Exhibit 14: PF3S27 4N Module
Exhibit 15: PF3S27 4N Hybrid Module Component Diagram
Exhibit 16: Section B Component Diagram
Exhibit 17: dTRU Small Signal Transmit Block Diagram
Exhibit 18: Section C Component Diagram
Exhibit 19: IF Rx SAW Filter Close Up
Exhibit 20: EPCOS B3625 Input/Output Matching Recommendation
Exhibit 21: PF3S25 46 Module
Exhibit 22: PF3S25 46 Hybrid Module Component Diagram
Exhibit 23: Section D Component Diagram
Exhibit 24: Section E Component Diagram
Exhibit 25: R1E RYT9026010/2 R1D Module
Exhibit 26: R1E RYT9026010/2 R1D Component Diagram (Shielding Intact)
Exhibit 27: RYT9026009/2 R1D Module
Exhibit 28: RYT9026009/2 R1D Hybrid Module Component Diagram (Shielding Removed)
Exhibit 29: RF Power Amplifier 1 Printed Circuit Board (Top View)
Exhibit 30: RF Power Amplifier 2 Printed Circuit Board (Top View)
Exhibit 31: RF Power Amplifier 1 PCB Top View Diagram
Exhibit 32: RF Power Amplifier 2 PCB Top View Diagram
Exhibit 33: RF Power Amplifier 1 Mechanical Side View Diagram
Exhibit 34: RF Power Amplifier 2 Mechanical Side View Diagram
Exhibit 35: RF Power Amplifier 1 Shield Cover Top View Diagram
Exhibit 36: RF Power Amplifier 2 Shield Cover Top View Diagram
Exhibit 37: RF Power Amplifier 1 Shield Cover Bottom View Diagram
Exhibit 38: RF Power Amplifier 2 Shield Cover Bottom View Diagram
Exhibit 39: RF Power Amplifier 1 Power Supply Component Diagram
Exhibit 40: 850MHz GSM/EDGE Power Amplifier Block Diagram
Exhibit 41: RF Power Amplifier 1 RF Transmitter Section Component Diagram
Exhibit 42: RF Power Transistor
Exhibit 43: De-Capped RF Power Transistor
Exhibit 44: Electrical Circuit Model for RF Power Transistor
Exhibit 45: RF Power Transistor Wire Bonding Diagram
Exhibit 46: RF Transistor Die Type Identification
Exhibit 47: Close-up Magnification View of Transistor Geometry
Exhibit 48: Passive Component Case Size Distribution
Exhibit 49: Active Semiconductor Component Market Share

For full details, please email keithw@cmsinfo.com

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