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A Comprehensive Analysis of the Sprint AIRAVE CDMA 1900MHz Femtocell BTS
This report covers the design analysis of an Sprint AIRAVE CDMA 1900MHz femtocell BTS unit. The unit was manufactured in mid-2007.
A complete bill of materials of all active semiconductors and passive components is presented with the following information:
Complete Part Number/Marking
Component Manufacturer Identification
Functional Component Description
Package Type
TARGETED USERS:
Mobile Operators
Base Station Equipment OEMs
RF Subsystems Manufacturers
Semiconductor Manufacturers
BENEFITS:
Proprietary Data
Comprehensive Bill of Materials Analysis
Mechanical Design Analysis
FEATURES:
Full Color Pictures of PCB
Mechanical Drawings and Dimensions
Complete Part Number Identification
Complete Component PCB Placement Identification
SUPPLIERS:
The following semiconductor & passive component suppliers are included in this report:
Analog Devices
Avago Technologies
AVX Corporation
Cortina Systems
EPCOS
Lattice Semiconductor
Linear Technology
Maxim Integrated Circuits
Murata Electronics Co., Ltd.
NEC Electronics
Samsung Electronics
Skyworks Solutions
SST
Texas Instruments & Trimble Navigation
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Table of Contents
EXECUTIVE SUMMARY
Active/Passive Component Summary
Important Note:
CHAPTER 1 SPRINT FEMTOCELL TECHNOLOGY
1.1 Overview of Femtocell Technology
CHAPTER 2 AIRAVE PRODUCT
2.1 Product/Mechanical Analysis
2.2 System Architecture Analysis
2.3 Baseband CDMA Processor Section
2.3 Power Management Section
2.3 RF Transmit/Receive Section
2.4 GPS Receiver Section
2.5 Internal GPS Antenna Section
2.6 External GPS Antenna Section
APPENDIX A - PASSIVE CASE SIZE ANALYSIS
APPENDIX B - ACTIVE COMPONENT MARKET SHARE
TABLES
Table 1: Bandwidth Requirements for Active Callers
Table 2: AIRAVE Processor Section Bill of Materials
Table 3: AIRAVE Power Management Section Bill of Materials
Table 4: AIRAVE RF Transmit/Receive Section RFA Bill of Materials
Table 5: AIRAVE RF Transmit/Receive Section RFB Bill of Materials
Table 6: GPS Daughter card Front Bill of Materials
Table 7: GPS Daughter card Back Bill of Materials
Table 8: GPS Shielded Section Bill of Materials
Table 9: AIRAVE Internal GPS Antenna Bill of Materials
Table 10: AIRAVE External GPS Antenna Bill of Materials
Table 11: Active/Passive Component Distribution by System Subsection
EXHIBITS
Exhibit 1: Sprint Airwave Femtocell Network Diagram
Exhibit 2: Sprint AIRWAVE Product
Exhibit 3: Sprint AIRAVE Front and Rear View
Exhibit 4: AIRAVE Side View
Exhibit 5: AIRAVE Back View
Exhibit 6: AIRAVE Bottom View
Exhibit 7: AIRAVE Sprint Product Label
Exhibit 8: AIRAVE Product Label
Exhibit 9: AIRAVE Cover Inside
Exhibit 10: AIRAVE Body Front
Exhibit 11: AIRAVE Body Back
Exhibit 12: AIRAVE System
Exhibit 13: AIRAVE PCB Back
Exhibit 14: AIRAVE Processor Section Component Diagram
Exhibit 15: AIRAVE Power Management Section Component Diagram
Exhibit 16: AIRAVE RF Transmit/Receive Section RFA & RFB
Exhibit 17: AIRAVE RF Transmit/Receive Section RFA Component Diagram
Exhibit 18: PCS Antenna Duplexer Module
Exhibit 19: AIRAVE GPS Receiver Section Component Diagram, Front
Exhibit 20: AIRAVE GPS Receiver Section Component Diagram, Back
Exhibit 21: AIRAVE GPS Receiver Shielded Section Component Diagram
Exhibit 22: AIRAVE Internal GPS Antenna
Exhibit 23: AIRAVE Internal GPS Antenna Dimensions
Exhibit 24: AIRAVE Internal GPS Antenna Component Diagram
Exhibit 25: AIRAVE External GPS Antenna Dimensions
Exhibit 26: AIRAVE External GPS Antenna Component Diagram
Exhibit 27: Passive Component Case Size Distribution
Exhibit 28: Active Component Analysis by Pin Count
Exhibit 29: Active Semiconductor Component Market Share
For full details, please email keithw@cmsinfo.com
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