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Home > Market Research > Networks & Infrastructure > Design Analysis Nokia WCDMA 2100 MHz Power Amplifier
This report within the EJL Wireless Research proprietary DNA-I series details the Nokia WPAB W-CDMA 2100MHz power amplifier unit. The unit was built by Powerwave Technologies for Nokia.
“The W-CDMA wireless infrastructure market achieved record shipment levels in 2007, driven by more and more 3G wireless subscribers. This unit uses a traditional feed forward amplifier topology and offers our clients a unique opportunity to see, in our opinion, the higher cost design of the power amplifier from Powerwave Technologies as compared to the Ericsson W-CDMA power amplifier design from the same generation,” says founder and President, Earl Lum.
“We are excited to have the opportunity to showcase this unit as well as power amplifiers, transceivers, remote radio heads and base stations from other wireless equipment OEMs as part of our DNA-I program,” says Lum.
Component and semiconductor suppliers mentioned in this report include: AcBel Polytech, Ace Technology, Analog Devices, Anaren Microwave, Bourns, Fairchild Semiconductor, Freescale Semiconductor, International Rectifier, Kemet, Linear Technology, Maxim Integrated Circuits, Murata Electronics Co., Ltd., ON Semiconductor, RF Microdevices, Skyworks Solutions, STMicroelectronics, Texas Instruments, and Xilinx.
The report covers the design analysis of an Nokia WCDMA 2100MHz 30W power amplifier unit. This unit is an integral part of a Nokia WCDMA base transmitting station (BTS). The unit was manufactured in mid 2002.
Component suppliers mentioned in this report include: AcBel Polytech, Ace Technology, Analog Devices, Anaren Microwave, Bourns, Fairchild Semiconductor, Freescale Semiconductor, International Rectifier, Kemet, Linear Technology, Maxim Integrated Circuits, Murata Electronics Co., Ltd., ON Semiconductor, RF Microdevices, Skyworks Solutions, STMicroelectronics, Texas Instruments, and Xilinx.
Features
Complete Part Number/Marking
Component Manufacturer Identification
Function Component Description
Package Type
Total Pages: 67
Total Tables: 27
Total Exhibits: 65
Important Note: There is NO component pricing contained within the report.
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Table of Contents
EXECUTIVE SUMMARY ..5
Active/Passive Component Summary . 5
Important Note: .. 5
CHAPTER 1 POWER AMPLIFIER TECHNOLOGY6
1.1 Overview of Nokia UltraSite 3G BTS 6
CHAPTER 2 W-CDMA POWER AMPLIFIER PRODUCT 7
2.1 Mechanical Analysis . 7
2.2 System Architecture Analysis ..13
2.3 DC/DC Power Supply Section16
2.4 RF Cavity Filter Section .28
2.5 Digital Baseband Section ..32
2.6 High Power RF Section ..49
APPENDIX A - PASSIVE CASE SIZE ANALYSIS 62
APPENDIX B - ACTIVE COMPONENT MARKET SHARE . 64
TABLES
Table 1: Digital/RF Cable Bill of Materials . 12
Table 2: Power Supply Bill of Materials . 18
Table 3: M2 Module Bill of Materials .. 20
Table 4: DC-DC Converter Module PCB Bill of Materials 23
Table 5: DC-DC Converter Module Daughter Card 1 Bill of Materials 25
Table 6: DC-DC Converter Module Daughter Card 2 Bill of Materials 26
Table 7: Power Supply Connector PCB Bill of Materials. 27
Table 8: RF Cavity Filter Bill of Materials .. 31
Table 9: Digital Baseband Section Bill of Materials Area 1 42
Table 10: Digital Baseband Section Bill of Materials Area 2. 42
Table 11: Digital Baseband Section Bill of Materials Area 3. 42
Table 12: Digital Baseband Section Bill of Materials Area 4. 43
Table 13: Digital Baseband Section Bill of Materials Area 5. 43
Table 14: Digital Baseband Section Bill of Materials Area 6. 44
Table 15: Digital Baseband Section Bill of Materials Area 7. 44
Table 16: Digital Baseband Section Bill of Materials Area 8. 44
Table 17: Digital Baseband Section Bill of Materials Area 9. 45
Table 18: Digital Baseband Section Bill of Materials Area 10 .. 46
Table 19: Digital Baseband Section Bill of Materials Area 11 .. 46
Table 20: Digital Processor Module Bill of Materials .. 48
Table 21: Area A Small Signal Pre Driver Amplifier Section Bill of Materials .. 54
Table 22: Area B RF Driver Pallet Bill of Materials.. 55
Table 23: Area C High Power RF Output Pallet Bill of Materials .. 57
Table 24: Area C High Power RF Input/Output PCB Bill of Materials . 57
Table 25: Area D High Power RF Error Amplifier Small Signal Bill of Materials .. 60
Table 26: Area E High Power RF Error Amplifier Driver/Output Pallet Bill of Materials. 61
Table 27: Active/Passive Component Distribution by System Subsection 63
EXHIBITS
Exhibit 1: Nokia UltraSite BTS 6
Exhibit 2: Power Amplifier System Case Dimensions7
Exhibit 3: RF Cables 1 ..8
Exhibit 4: RF Cables Component Diagram 1 ..9
Exhibit 5: RF Cables 2 10
Exhibit 6: RF Cables Component Diagram 1 10
Exhibit 7: Digital Cables Component Diagram. 11
Exhibit 8: Digital Cables Component Diagram. 11
Exhibit 9: Power Amplifier Sub-System Diagram 13
Exhibit 10: Power Amplifier RF Sub-System Diagram 14
Exhibit 11: Power Supply Location . 15
Exhibit 12: Basic Feed Forward Amplifier Block Diagram . 15
Exhibit 13: Power Supply Location . 16
Exhibit 14: Power Supply Component Diagram .. 17
Exhibit 15: M2 Module PCB Top View. 19
Exhibit 16: M2 Module PCB Bottom View.. 19
Exhibit 17: DC-DC Converter Module, Top View . 22
Exhibit 18: DC-DC Converter Module Component Diagram. 22
Exhibit 19: DC-DC Converter Module Daughter Card 1. 24
Exhibit 20: DC-DC Converter Module Daughter Card 2. 24
Exhibit 21: Power Supply Connector PCB, Top View.. 27
Exhibit 22: Power Supply Connector PCB, Bottom View 27
Exhibit 23: RF Cavity Filter, Top.. 28
Exhibit 24: RF Cavity Filter, Bottom 28
Exhibit 25: RF Cavity Filter Transmit Diagram. 29
Exhibit 26: RF Cavity Filter, Bottom without Waveguide Shielding 29
Exhibit 27: RF Cavity Filter, Top Component Diagram.. 29
Exhibit 28: RF Cavity Filter, Bottom Component Diagram 30
Exhibit 29: RF Cavity Filter, Bottom with Stripline PCBs Removed 30
Exhibit 30: Digital Baseband Section PCB Top View .. 32
Exhibit 31: Digital Baseband PCB Bottom View .. 33
Exhibit 32: Digital Baseband Section Area 1 33
Exhibit 33: Digital Baseband Section Area 2 34
Exhibit 34: Digital Baseband Section Area 3 34
Exhibit 35: Digital Baseband Section Area 4 34
Exhibit 36: Digital Baseband Section Area 5 35
Exhibit 37: Digital Baseband Section Area 6 35
Exhibit 38: Digital Baseband Section Area 7 36
Exhibit 39: Digital Baseband Section Area 8 36
Exhibit 40: Digital Baseband Section Area 9 37
Exhibit 41: Digital Baseband Section Area 10 . 37
Exhibit 42: Digital Baseband Section Area 10 Top . 38
Exhibit 43: Digital Baseband Section Area 10 Middle 38
Exhibit 44: Digital Baseband Section Area 10 Bottom .. 38
Exhibit 45: Digital Baseband PCB Dimensions . 39
Exhibit 46: Digital Baseband Shield Bottom, Bottom View .. 40
Exhibit 47: Digital Baseband Shield Bottom, Top View . 40
Exhibit 48: Digital Baseband Shield Top, Top View 41
Exhibit 49: Digital Baseband Shield Top, Bottom View . 41
Exhibit 50: Digital Processor Module PCB, Top View.. 47
Exhibit 51: Digital Processor Module PCB, Bottom View 47
Exhibit 52: RF Shielding for Power Amplifier 49
Exhibit 53: High Power RF Section Diagram. 50
Exhibit 54: High Power Pallet Shield Cover, Top and Bottom Views.. 51
Exhibit 55: RF Main Amplifier Transmit Diagram 52
Exhibit 56: Small Signal Pre Driver Amplifier Section Component Diagram 53
Exhibit 57: RF Driver Pallet Component Diagram 53
Exhibit 58: High Power RF Output Pallet Component Diagram 56
Exhibit 59: High Power RF Error Amplifier Small Signal Section Component Diagram. 58
Exhibit 60: High Power RF Error Amplifier Transmit Diagram . 59
Exhibit 61: High Power RF Error Amplifier Driver/Output Pallet Component Diagram . 59
Exhibit 62: Component Distribution Analysis .. 62
Exhibit 63: Passive Component Distribution Analysis 63
Exhibit 64: Active Component Analysis by Pin Count 64
Exhibit 65: Active Semiconductor Component Market Share .. 65
For full details, please email keithw@cmsinfo.com
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